Parts of apparatus for physical deposition by sputtering on semiconductor wafers , other than subheading no.8479.89 .
非属第8479.89目之供溅镀半导体晶圆产生物理气相沈积之器具之零件。
Other tropical wood specified in subheading note 1 to this chapter , sawn or chipped lengthwise , sliced or peeled , whether or not planed , sanded or finger-jointed , of a thickness exceeding 6 mm .
Other veneered panels and similar laminated wood , with both outer plies of coniferous wood , containing at least one ply of tropical wood specified in subheading note 1 to this chapter and one layer of particle board .
The author summed up years of exasperation in one subheading : " does logic help ? "
作者总结了几年来的恼怒,在一副标题中写道:“逻辑有用吗?”
Other tropical wood specified in subheading note 1 to this chapter , sawn or chipped lengthwise , sliced or peeled , whether or not planed , sanded or end-jointed , of a thickness exceeding 6 mm .